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A little bit about the author She likes to read, can write a little too and when not stuck in the house she likes to go for jogs.Polymorphism, transcriptional regulation and expression of the O6-methylguanine-DNA methyltransferase from a human keratinocyte cell line. We have studied the transcriptional regulation of the human O6-methylguanine-DNA methyltransferase (MGMT) gene in a human keratinocyte cell line, GM9691, transformed by chemical carcinogens and benzo(a)pyrene. In this cell line, MGMT transcription was observed to be repressed in a dose- and time-dependent manner, reaching a maximum level 12 h after exposure to benzo(a)pyrene. The complete mRNA precursor was isolated and characterized. A 12.6-kb genomic segment of the MGMT gene was sequenced, and a cluster of five DNase hypersensitive sites was identified within this segment. A minor DNA variant of the MGMT gene was detected by single-strand conformation polymorphism analysis and PCR-based cloning. This minor variant, identified as an A-to-G transition, causes an amino acid change at codon 76 from histidine to arginine. By transient transfection assays of GM9691 cells, this variant was found to result in a threefold increase in the MGMT promoter activity. This variant was shown to be present in a proportion of MGMT transcripts in the transformed cells. These observations suggest the existence of a polymorphic variant of the MGMT gene in human cells.1. Field of the Invention The present invention relates to improvements in the construction of an apparatus for facilitating the cleaning and decontamination of semiconductor wafers, while the wafers are being handled in a cassette or are being removed therefrom, and more particularly concerns improvements in the apparatus disclosed in U.S. application Ser. No. 847,825, filed Dec. 20, 1977, now U.S. Pat. No. 4,171,951 in which a flexible, sealable barrier is applied to the cassette or to the wafer, and includes a wafer receiving recess and a removable wafer retaining member. 2. Description of the Prior Art During the manufacture of semiconductor devices, it is frequently necessary to manually decontaminate contaminated portions of the wafer. These contaminated portions may include various defects, such as, particles of foreign
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